Unique Sample Preparation Process for Electron Microscopy

TEM, SEM and FIB sample preparation for
materials science, nanotechnology and semiconductor industry

• Ion beam thinning in 30 eV – 20 000 eV range
• Artifact-free and damage-free samples
• Fast ultra-high-energy milling
• Trimming & cleaning of FIB samples
• Slope cutting and cleaning of SEM samples
• Low-energy ion sources for analytical

   applications (AES, UPS, XPS and SIMS)