Unique advantages of holographic stress measurements
Higher accuracy
1.) Complete information about the displacement field to calculate stress
- full-field measurement (and in each point simultaneously)
- everywhere on the surface, at arbitrary distances from the rim of the hole
- 3D vector displacement measurement and with this more accurate stress/li>
General applicability
2.) Measurement possibility for curved or distributed surfaces
3.) Measurement possibility for surfaces with limited access (close to curves or corners)
4.) Reduced requirement for surface quality (cleanliness, surface roughness)
Reduced requirements toward the environment (within optical labor conditions)
5.) Relative temperature independence
Shorter preparation time
6.) One-step preparation (in case of the existence of the required supporting surfaces)
- only initial fastening on the measurement palette
Better, "real-time" repeatability
7.) Prompt and unlimited repeatability (with re-drilling of holes)
- possibility of monitoring changes of the stress field on the surface
- possibility of monitoring changes of the stress field in time (at spontaneous, or purposeful changes, too)
- possibility of monitoring the quality of nominally identical objects (at series production)
Not needed:
8.) Any type of consumables (strain gage, special glue etc.)
9.) Precise positioning of drillings
10.) Precise electronic data gathering
For more information please visit www.feszultsegmeres.com
